AERO-FY Developing Etching and Film DES

Device Function

  • Transfer speed:0.1-8.0M/MIN
  • Substrate specification
    • 640X640mm(max)
    • 200X200mm(min)
    • 0.04-3.2mm (Thick)
  • Processing capacity
    • 11-18L/min


Introduction to equipment features

1. The film removal rate is higher than 95%. 

2. The development section uses dry film, wet film, and solder resist development 

3. The development nozzle is designed in one piece. 

We offer the flexibility to tailor other specifications according to the unique needs of our clients. Please contact us for further discussion.