Technical Documents
Leadless packages with enhanced board level solder joint reliabilityfor automotive application
Quad (VFQFN) and dual in line (PowerFLATTM) are very low space occupancy, lead-less packages with enhanced thermal performances. On the purpose to be compliant with automotive reliability requirements, these packages are constructed with Exposed pad and WETTABLE flank that guarantee board level solder joint quality and inspectability…
Board Level Application Notes for Sawn Singulated DFN and QFN Wettable Flank Packages
Various ON Semiconductor components are packaged in an advanced Dual or Quad Flat*Pack No*Lead package (DFN/QFN). The DFN/QFN platform represents the latest in surface mount packaging technology. It is important to follow the suggested board mounting guidelines outlined in this document. These guidelines include printed circuit board mounting pads, solder mask…
The Value of Wettable Flank-plated QFN Packaging for Automotive Applications
To ensure that cars meet today’s demand for safety and high reliability, the automotive industry requires original equipment manufacturers (OEMs) to perform 100% automatic visual inspection (AVI) post-assembly. In the case of quad-flat no-lead (QFN) packages, there is no easily viewed solderable or exposed pins/terminals that enable you to determine…
TPS62097-Q1 2-A High Efficiency Step-Down Converter in Wettable Flanks QFN Packageive application
The TPS62097-Q1 device is a synchronous step- down converter optimized for high efficiency and noise critical applications. The devices focus on high efficiency conversion over a wide output current range. At medium to heavy loads, the converter operates in PWM mode and automatically enters Power Save Mode operation at light…